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Location: 首页  »   Products  »   Huangguang District equipment  »   HMDS pretreatment system

Huangguang District equipment

HMDS pretreatment system

HMDS pretreatment system

Advantages of the HMDS pretreatment system:

1.The pretreatment performance is better. Because it does HMDS treatment after several times of nitrogen replacement, there will be no dust interference. Moreover, since the system is to put "de-water baking" and HMDS treatment in the same place; the process is carried out in the same container; the wafer is first baked in a container at 100 ° C - 200 ° C, followed by HMDS treatment, it does not need to be transferred from the container; owing to bo exposed to atmosphere, the opportunities that the wafer absorbs water molecules are greatly reduced, so there is a better processing effect. Wait

2.The treatment is more uniform. Since it is applied to the surface of the wafer in the form of steam, there is better uniformity in liquid coating.

3. High efficiency. Liquid coating is a single piece operation, and the system can process up to 4 boxes of wafers at a time.

4.More saving of liquid medicine. It has been proved that the liquid medicine used for coating a single piece with liquid HMDS is more than the liquid medicine used for processing 4 boxes of wafers by the system;

5. More environmentally friendly and safe, HMDS is a toxic chemical. People will have nausea, vomiting, abdominal pain, stimulation of the chest, respiratory tract, etc. after inhalation. Since the whole process is completed in a closed environment, no one will be exposed to the liquid medicine. And its exhaust gas is pumped directly to the exhaust gas processor, so it does not pollute the environment.


  • Product Details
  • Features
  • Application Areas

HMDS pretreatment system

1. The necessity of HMDS pretreatment system: In the semiconductor production process, lithography is a crucial process link. The quality of the gluing process directly affects the quality of lithography. So gluing process is especially necessary to apply glue. Especially when the lines are relatively thin, any one of the links is a little leaky, which may lead to the failure of lithography.   In the gluing process, most of the photoresist used is hydrophobic, and the hydroxyl groups on the surface of the wafer and the residual water molecules are hydrophilic. If the film is directly coated on the surface of the wafer, the photoresist and the adhesion of the wafer will be poor, and even local gaps or bubbles are caused. The thickness and uniformity of the coating are affected, thereby affecting the lithography effect and development. In order to solve this problem, a chemical preparation, HMDS, was introduced in the gluing process. Its full name in English is Hexamethyldisilazane (HMDS), and its chemical name is hexamethyldisilazide. After it is applied to the surface of the silicon wafer, by heating, it can react to form a siloxane-based compound, which is actually a surfactant. It successfully changes the surface of the silicon wafer from hydrophilic to hydrophobic, and its hydrophobic group can be well lithographically. Its hydrophobic base can be well combined with photoresist to play a coupling role. Further, during the development process, since it enhances the adhesion of the photoresist to the substrate, the etching of the etching liquid into the mask and the substrate is effectively suppressed. Initially, liquid HMDS was applied directly to the wafer and a layer of HMDS film was formed on the surface of the wafer by high speed rotation of the wafer. This solves the problem of bonding between the substrate and the photoresist in stages. But as the lithographic lines become thinner and thinner and the glue becomes thinner and thinner, which puts higher requirements on adhesion, we have developed the current HMDS special oven.

2. Advantages of the HMDS pretreatment system:

  2.1 The pretreatment performance is better. Because it does HMDS treatment after several times of nitrogen replacement, there will be no dust interference. Moreover, since the system is to put "de-water baking" and HMDS treatment in the same place; the process is carried out in the same container; the wafer is first baked in a container at 100 ° C - 200 ° C, followed by HMDS treatment, it does not need to be transferred from the container; owing to bo exposed to atmosphere, the opportunities that the wafer absorbs water molecules are greatly reduced, so there is a better processing effect. Wait

   2.2 The treatment is more uniform. Since it is applied to the surface of the wafer in the form of steam, there is better uniformity in liquid coating.

   2.3 High efficiency. Liquid coating is a single piece operation, and the system can process up to 4 boxes of wafers at a time.

 2.4 More saving of liquid medicine. It has been proved that the liquid medicine used for coating a single piece with liquid HMDS is more than the liquid medicine used for processing 4 boxes of wafers by the system;

2.5 More environmentally friendly and safe, HMDS is a toxic chemical. People will have nausea, vomiting, abdominal pain, stimulation of the chest, respiratory tract, etc. after inhalation. Since the whole process is completed in a closed environment, no one will be exposed to the liquid medicine. And its exhaust gas is pumped directly to the exhaust gas processor, so it does not pollute the environment.

3. Machine size, vacuum chamber size:

   3.1 Liner size: 450*450*450mm, 300*300*300; 650*650*650

   3.2 vacuum: 150Pa; using a vacuum pump

   3.3 Heating method: The lower part of the cavity and the sides are heated. The heater is a built-in heating plate

   3.4 Temperature: RT+10°C200°C; Microcomputer temperature controller, accurate and reliable temperature control.

   3.5 temperature control accuracy: ± 2% ° C (within 200 ° C);

   3.6 can put about 2 pieces of LED chips 2 inches;

   3.7 The unpacking temperature can be set by the user to reduce the process time (the normal process is 50 minutes-90 minutes (the baking time is required according to the product), and the cooling time is not included in the normal working cycle (because the cooling time is the conventional cooling) );

   3.8 The whole system is made of high-quality materials, no dust-free materials, and is suitable for 100-level lithography room purification environment. The tempered and tempered glass door observes the objects in the working room at a glance. The closed door can be adjusted tightly, and the integrally formed silicone rubber door seal ring ensures high vacuum inside the box. The studio is made of stainless steel (or brushed) to ensure durability.

 

HMDS introduction

HMDS: Hexamethyldisilazane

HMDS:Hexamethyldislazane

Molecular formula:(CH3)3SiNHSi(CH3)3

The effect of HMDS is to replace the hydrophilic hydroxyl (OH) on the surface of the silicon wafer to the hydrophobic OSi (CH3) 3 by chemical reaction, and the HMDS's steam changes the wafer surface from the hydrophilic (Hydrophilic) to hydrophobicity (Hydrophobic) by heating (125 degrees). 

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Contact angle

Confirming the effect of HMDS is measured by contact angle (contact angle), generally between 60 and 70 degrees.

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HMDS pretreatment system

Advantages of the HMDS pretreatment system:

1.The pretreatment performance is better. Because it does HMDS treatment after several times of nitrogen replacement, there will be no dust interference. Moreover, since the system is to put "de-water baking" and HMDS treatment in the same place; the process is carried out in the same container; the wafer is first baked in a container at 100 ° C - 200 ° C, followed by HMDS treatment, it does not need to be transferred from the container; owing to bo exposed to atmosphere, the opportunities that the wafer absorbs water molecules are greatly reduced, so there is a better processing effect. Wait

2.The treatment is more uniform. Since it is applied to the surface of the wafer in the form of steam, there is better uniformity in liquid coating.

3. High efficiency. Liquid coating is a single piece operation, and the system can process up to 4 boxes of wafers at a time.

4.More saving of liquid medicine. It has been proved that the liquid medicine used for coating a single piece with liquid HMDS is more than the liquid medicine used for processing 4 boxes of wafers by the system;

5. More environmentally friendly and safe, HMDS is a toxic chemical. People will have nausea, vomiting, abdominal pain, stimulation of the chest, respiratory tract, etc. after inhalation. Since the whole process is completed in a closed environment, no one will be exposed to the liquid medicine. And its exhaust gas is pumped directly to the exhaust gas processor, so it does not pollute the environment.


 The necessity of HMDS pretreatment system: In the semiconductor production process, lithography is a crucial process link. The quality of the gluing process directly affects the quality of lithography. So gluing process is especially necessary to apply glue. Especially when the lines are relatively thin, any one of the links is a little leaky, which may lead to the failure of lithography.   In the gluing process, most of the photoresist used is hydrophobic, and the hydroxyl groups on the surface of the wafer and the residual water molecules are hydrophilic. If the film is directly coated on the surface of the wafer, the photoresist and the adhesion of the wafer will be poor, and even local gaps or bubbles are caused. The thickness and uniformity of the coating are affected, thereby affecting the lithography effect and development. In order to solve this problem, a chemical preparation, HMDS, was introduced in the gluing process. Its full name in English is Hexamethyldisilazane (HMDS), and its chemical name is hexamethyldisilazide. After it is applied to the surface of the silicon wafer, by heating, it can react to form a siloxane-based compound, which is actually a surfactant. It successfully changes the surface of the silicon wafer from hydrophilic to hydrophobic, and its hydrophobic group can be well lithographically. Its hydrophobic base can be well combined with photoresist to play a coupling role. Further, during the development process, since it enhances the adhesion of the photoresist to the substrate, the etching of the etching liquid into the mask and the substrate is effectively suppressed. Initially, liquid HMDS was applied directly to the wafer and a layer of HMDS film was formed on the surface of the wafer by high speed rotation of the wafer. This solves the problem of bonding between the substrate and the photoresist in stages. But as the lithographic lines become thinner and thinner and the glue becomes thinner and thinner, which puts higher requirements on adhesion, we have developed the current HMDS special oven.


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